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Ga alloys have been attracting significant renewed attention for low-temperature bonding applications in electronic packaging. This study systematically investigates the interfacial reaction between liquid Ga and Cu-10Ni substrates at 30 °C. In addition to CuGa2 formed from binary Ga/Cu couples, a layer of nanocrystalline Ga5Ni and CuGa2 formed between the Cu-10Ni substrate and the blocklike micrometer scale CuGa2 layer. The growth of interfacial intermetallics (IMCs) on the Cu-10Ni substrate was substantially accelerated compared to the
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