Wafer Level Packaging Technologies Market, Global Outlook and Forecast 2024-2030 || Download FREE Sample of this Report https://lnkd.in/dsjHw3vD
The global Wafer Level Packaging Technologies market was valued at US$ 2676.3 million in 2023 and is projected to reach US$ 4672.9 million by 2029, at a CAGR of 8.3% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
key players include:
Samsung Electro-Mechanics
TSMC
Amkor Technology, Inc.
Orbotech
Advanced Semiconductor Inc.
Deca Technologies
STATS ChipPAC
nepes
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