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In this paper, a novel inter-layer exchange coupled (IEC) based 3-input full adder design methodology is proposed and subsequently the architecture has been implemented on the widely accepted micromagnetic OOMMF platform. The impact of temperature on the IEC coupled full-adder design has been analyzed up to Curie temperature. It was observed that even up to Curie temperature the IEC based adder design was able to operate at sub-50 nm as contrast to dipole coupled adder design which failed at 5 K for sub 50 nm. Simulation results obtain
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